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Product binning : ウィキペディア英語版 | Product binning
In semiconductor device fabrication, product binning is the categorizing of finished products based on their thermal and frequency characteristics. ==Definition== Semiconductor manufacturing is an imprecise process, sometimes achieving as low as 30% yield. Defects in manufacturing are not always fatal, however; in many cases it is possible to salvage part of a failed batch of integrated circuits by modifying performance characteristics. For example, by reducing the clock frequency or disabling non-critical parts that are defective, the parts can be sold at a lower price, fulfilling the needs of lower-end market segments. This practice occurs throughout the semiconductor industry on products such as CPUs, RAM and GPUs.
抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)』 ■ウィキペディアで「Product binning」の詳細全文を読む
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